Creating Higher Performance, Lower Power IoT devices while eXecuting-in-Place (XiP)

first_imgAs demand for higher performance, lower power consumption and lower cost continues relentlessly, system designers find that existing embedded solutions no longer meet requirements. Switching from embedded flash or SRAM to eXecute-in-Place (XiP) technology holds great promise for small embedded systems, but as many designers know, building a system with XiP requires solving key challenges in terms of performance and system cost. In this webtalk, Gideon Intrater, CTO of Adesto Technologies, presents a new approach for designing a XiP-based system that overcomes the performance and cost issues associated with existing MCUs and Flash devices.Share this:TwitterFacebookLinkedInMoreRedditTumblrPinterestWhatsAppSkypePocketTelegram Tags: Chips & Components Continue Reading Previous Leading standards in the wireless charging marketNext congatec: SMARC makes digital cockpit designs smarterlast_img

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